High Thermal Conductive Metal Phase Changing Materials For Microprocessors

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Phase Changing Materials [37]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [33]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

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City: Dongguan

Province/State: Guangdong

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High Thermal Conductive Metal Phase Changing Materials For Microprocessors

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High Thermal Conductive Metal Phase Changing Materials For Microprocessors

High Thermal Conductive Metal Phase Changing Materials For Microprocessors Chipsets TS-Ziitek-Sharp Metal x01 is a new type of alloy phase changing heat conduction product made from a mixture of ...

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Microprocessors Chipsets Metal Phase Changing Materials

Microprocessors Chipsets Phase Changing Materials

High Thermal Conductive Phase Changing Materials

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