TIF050-11 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF050-11 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF050-11 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF050-11 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF050-11 Series Datasheet-REV02.pdf
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
Feature
>Thermal conductivity: 5W/mK
>Soft, very low compression
>Operate automaticly
>Soft and Compressible for low stress applications
| TIFTM050-11 Property |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ********** |
| Viscosity | 2000,000cps | GB/T 10247 |
| Specific Gravity | 3.05 g/cc | ASTM D297 |
| Thermal conductivity | 5.0 W/mK | ISO 22007-2 |
| Thermal diffusivity | 1.695 mm2/s | ISO 22007-2 |
| Specific heat capacity | 2.3 MJ/m3K | ISO 22007-2 |
| Continuous Use Temperature | -45 ~200°C | ****** |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 |
| Flame Rating | 94V0 | E331100 |
| Outgassing,%TML | 0.60% | ASTM E595
|
Package :
•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
